Software features improved results evaluation
An
Algor product story
Edited by the Engineeringtalk editorial team
Mar 26, 2004
A new version of Algor features extra result evaluation and presentation options; a new iterative solver; and new capabilities for mechanical event simulation, electrostatics and heat transfer.
A new version of Algor features additional result evaluation and presentation options; an all-new, fast, iterative solver; new analysis capabilities for mechanical event simulation, electrostatics and heat transfer; and much more.
"Algor V14.3 will help engineers perform more analyses in less time and then give them more options for evaluating and presenting their results", said Algor Product Manager, Bob Williams.
"This new release provides significantly faster solution times, especially for large CAD assemblies, through an all-new iterative solver and provides an expanded results environment with many new ease-of-use and display options, such as built-in, virtual instrumentation and the ability to define result probes".
New result evaluation and presentation options in the Superview IV results environment also include: built-in, virtual instrumentation through an all-new monitor for time-dependent result plots; the ability to define result probes at desired locations; annotations to highlight the location of minimum and maximum results; the ability to display undisplaced models using transparency; the ability to display impact planes for MES; an embedded animation player; and automatic generation of result images for inclusion in reports.
Algor V14.3 also includes an all-new iterative solver that significantly reduces the solution time of linear static stress, heat transfer, electrostatic and fluid flow analyses for mid- to large-size models such as CAD assemblies.
This new version also provides improved contact capabilities and a new spring element for MES which enables users to model a spring within a mechanism and display it through full, 3D visualisation.
Temperature-dependent materials for electrostatic analysis and viscous heating capabilities for heat transfer applications such as extrusion, compounding and injection and transfer moulding are also part of this latest release.
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