Product category:
Simulation, modelling and validation software
News Release from: Ansoft Europe | Subject: EMSS 3D and Maxwell 2D Thermal software
Edited by the Engineeringtalk Editorial
Team on 04 April 2001
Multiphysics analysis capability for
electronics
Ansoft Corporation has added two new software tools to its Maxwell EM product line for electromechanical design in electronic systems: EMSS 3D and Maxwell 2D Thermal.
Ansoft Corporation has added two new software tools to its Maxwell EM product line: EMSS 3D and Maxwell 2D Thermal EMSS 3D enables system level design engineers to include precise component models within a system simulation
This article was originally published on Engineeringtalk on 28 Apr 2000 at 8.00am (UK)
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Maxwell 2D Thermal allows designers to couple electromagnetic and thermal analysis to obtain temperature profiles of devices such as motors and transformers required by the automotive, aerospace, and defence markets.
EMSS is a technology breakthrough offered only by Ansoft.
Expanding this highly successful technology to three dimensions creates the opportunity to apply EMSS to a greater number of applications such as transformer and industrial control designs that could not easily be solved in two-dimensions.
EMSS 3D tightly integrates Ansoft's high accuracy finite element electromagnetic analysis solutions with popular system level simulation solutions such as SPICE.
EMSS provides a complete electromagnetics-to-system design environment that allows designers of non-linear magnetic components such as sensors and actuators to study the effects of design trade-offs and perform what-if analyses.
EMSS 3D eliminates costly prototype iterations and speeds time to market by accurately predicting non-linear effects of source and load transients, induced voltages and currents as well as position and velocity of moving parts.
Previously, system level simulations alone could only approximate non-linear effects, requiring designers to create costly hardware prototypes to ensure accuracy.
Maxwell 2D Thermal provides complete steady-state thermal analysis capability including convection and radiation and the ability to perform coupled electromagnetic-thermal field analysis.
This capability is especially important for designers of today's electronic products where physical size is decreasing and frequency increasing, causing temperatures to rise beyond expectations.
Maxwell 2D Thermal may be purchased as an add-on module to Maxwell 2D.
The addition of thermal analysis allows users to couple power loss information obtained in the eddy current solver as an input source for the thermal solver to obtain a complete thermal profile of a device.
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