Product category:
Simulation, modelling and validation software
News Release from: Ansoft Europe
Edited by the Engineeringtalk Editorial
Team on 29 March 2005
Technical paper gets award nomination
UMC's Albert Yen and Ansoft's Lawrence Williams, Daniel Wu and Eldon Staggs have received recognition in Designcon's Chip-Level Design Category for a technical paper.
UMC's Albert Yen and Ansoft's Lawrence Williams, Daniel Wu and Eldon Staggs have received recognition in Designcon's Chip-Level Design Category for a technical paper The paper, 'Ultra-wideband Radio Design for Multi-band OFDM 480 Mb/s Wireless USB', has received the outstanding contribution award at Designcon 2005
The paper outlined the design and simulation of a direct-conversion radio architecture in support of the Multiband OFDM Alliance (MBOA).
Designcon Paper Awards recognise papers based on the merits of the written document and on the quality of the document's presentation.
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