Speedy access to fused silica wafers
An
Armstrong Optical product story
Edited by the Engineeringtalk editorial team
Feb 15, 2005
Armstrong Optical now offers fused silica wafers, with standard wafer diameters including 100, 150 and 200mm delivered in less than 2 weeks.
Armstrong Optical now offers fused silica wafers, with standard wafer diameters including 100, 150 and 200mm delivered in less than 2 weeks.
Wafers down to 0.5mm in thickness are processed on double-sided polishers with less than 10 seconds of wedge and transmitted wavefront error of under one wave.
Stock wafer blank material is Corning 7980 fused silica, but wafers can also be produced from Heraeus Amersil and Schott Lithotec fused silica as well as other materials such as Borafloat, BK-7 and B270.
Wafers with different diameters, thickness and locating flats are also available, as are wire-sawn wafer blanks.
These wafers are ideal substrates for all WDWM, MEMS/MOEMS and chrome-on-glass mask manufacturing applications.
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