Product category:
Materials and components
News Release from: Armstrong Optical | Subject: Fused silica wafers
Edited by the Engineeringtalk Editorial
Team on 15 February 2005
Speedy access to fused silica wafers
Armstrong Optical now offers fused silica wafers, with standard wafer diameters including 100, 150 and 200mm delivered in less than 2 weeks.
Armstrong Optical now offers fused silica wafers, with standard wafer diameters including 100, 150 and 200mm delivered in less than 2 weeks Wafers down to 0.5mm in thickness are processed on double-sided polishers with less than 10 seconds of wedge and transmitted wavefront error of under one wave
Stock wafer blank material is Corning 7980 fused silica, but wafers can also be produced from Heraeus Amersil and Schott Lithotec fused silica as well as other materials such as Borafloat, BK-7 and B270.
Wafers with different diameters, thickness and locating flats are also available, as are wire-sawn wafer blanks.
These wafers are ideal substrates for all WDWM, MEMS/MOEMS and chrome-on-glass mask manufacturing applications.
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