Thermal sensor module boasts more useable pixels
An
Armstrong Optical product story
Edited by the Engineeringtalk editorial team
Aug 23, 2005
The new IR112 thermal sensor module offers users the ability to use 40% more pixels for 8-14um infra-red imaging applications.
Similar in size to the IR108 thermal sensor modules from Armstrong Optical of Northampton, the new IR112 thermal sensor module offers users the ability to use 40% more pixels for 8-14um infra-red imaging applications.
Based around a 384 x 288 pixel array of 35um-square pixels fabricated from amorphous silicon, the uncooled microbolometer array has been designed for easy integration into third-party thermal imaging camera systems.
Once again the sensor array module is truly plug-and-play with standard video output (Pal/NTSC) complimented by built-in FireWire 1394; gain, offset, zoom, brightness, contrast and image display are all available through standard interfaces increasing the versatility of this thermal sensor module.
The IR112 represents the latest of the new thermal imaging products available from Armstrong Optical - including a fully radiometric system the size of a mobile phone (the MobIR M4) and a new top-of-the-range hand-held system for predictive/preventive maintenance applications (the IR928+).
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