Bal Seal exhibits contact at MDandM show
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Bal Seal Engineering product story
Edited by the Engineeringtalk editorial team
Oct 21, 2009
Bal Seal Engineering will be demonstrating its Bal Conn electrical contact at the Medical Design and Manufacturing Show in Minneapolis, Minnesota.
Consisting of a small, precision-engineered canted-coil spring retained in a metal housing, the Bal Conn facilitates a reliable, uniform electrical connection between the battery and lead in implantable electronic devices.
The Bal Conn's spring coils, which adjust independently to maintain maximum contact with the lead, can be customised to meet specific requirements for insertion/removal forces and contact resistance.
The compact profile of the Bal Conn enables manufacturers to build in greater connector density for enhanced performance in the same limited space.
Diameters are available to fit any lead configuration, from IS1 and IS4 to 0.040.
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