Gold chip thermistors aim for space qualification
A
Betatherm product story
Edited by the Engineeringtalk editorial team
Mar 29, 2004
Betatherm Sensors has begun the evaluation process for its gold chip thermistors in conjunction with the European Space Agency (ESA).
Betatherm Sensors has begun the evaluation process for its gold chip thermistors in conjunction with the European Space Agency (ESA).
The evaluation is based on ESA detail specification ESCC 4006/012.
Betatherm has already achieved ESA Qualified Parts Listing for its epoxy-coated thermistors (Detailed Specification ESCC 4006/013) and surface probe sensors (Detailed Spec ESCC 4006/014).
Some of the world's largest aerospace prime contractors, secondary contractors and sourcing agents have worked with Betatherm.
These include Alenia, Astrium, Top-Rel, Technologica, Alcatel, Verhaert, Laben, Aeroflex, etc.
The company's competence is further demonstrated by the space programmes on which it has worked.
These include Space Bus, Rosetta, Satelcom, Spacecom, Hotbird, Globlastar, Nahual, Sicral, SAX, Arabsat and Optus.
At a time when the use of gold chips is steadily increasing in satellites, Betatherm will be the only NTC thermistor supplier to offer gold chips qualified to European Space Agency specifications, with reliability data on all products designed and industry best lead times.
The evaluation testing process for the gold chip thermistors is based on ESCC evaluation qualification 4006 Programme 2264000 and ESCC Generic 16 component variants, based on six resistance/temperature material curves and will be completed during 2004.
NTC thermistors maintain the critical temperature parameters of aerospace applications and this can vary from onboard temperature control and external temperature measurement to motor temperature measurement and strain measurement control.
The usage of gold chip thermistors in aerospace applications has increased dramatically over the past couple of years, particularly in the following applications: WDM (wavelength division multiplexing) for advanced frequency control in modern communications systems and wireless applications; thermopile sensors for thermal radiation recognition and infrared sensing; thermal protection of sensitive circuits; and hybrid circuit temperature compensation and localised temperature sensing.
Gold chip thermistors offer a number of advantages in temperature sensing applications, including: suitability for automated assembly using pick and place equipment; ease of assembly using conductive adhesive and wire bonding techniques; small size/mass leads to fast time response; reliable and stable performance over an extended period; ease of packaging and assembly due to size and shape; and the availability of a wide range of resistance values and resistance/temperature curves.
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