Compound provides chemical resistance
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Trelleborg Sealing Solutions UK product story
Edited by the Engineeringtalk editorial team
Aug 13, 2007
Trelleborg Sealing Solutions has released the newly developed Isolast Fab Range J9675.
Trelleborg Sealing Solutions has released the Isolast Fab Range J9675.
This sealing compound offers excellent chemical resistance and minimal particulation across a wide range of semiconductor wafer processes.
In particular, it gives enhanced performance in fluorine and oxygen based plasma environments.
Its curing and filler system ensures superior long-term properties in operating temperatures up to 300C.
The compound has been proven through field tests and in independent laboratories within both dry and plasma semiconductor processing environments.
"The compound and polymer technology available up until now has meant that engineers needed to choose a material for semiconductor equipment on the basis of a single characteristic", says Ursula Porelle, Product Manager for Isolast.
"To achieve good plasma resistance linked with low outgassing and particulation could result in sacrificing high-temperature performance and physical properties, compression set especially".
"While to ensure the highest purity, surface energy properties were compromised".
"With Isolast Fab Range J9675 this compromise is not required".
Typical applications for Isolast Fab Range J9675 are deposition, oxidation, diffusion, etching, ashing, metallisation and RTP processes.
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