High performance single slot CompactPCI controller
A
Concurrent Technologies product story
Edited by the Engineeringtalk editorial team
Nov 10, 2000
Concurrent Technologies has announced the release of its new single slot 6U CompactPCI System Controller Board featuring an 850MHz Intel Flip-Chip PGA 370 Pentium III processor in a single slot.
Concurrent Technologies has announced the release of its new single slot 6U CompactPCI System Controller Board featuring an 850MHz Intel Flip-Chip PGA 370 Pentium III processor in a single slot.
The PP SC2/P3x is ideally suited to provide an extended life cycle, high Performance PC-compatible applied computing platform for telecommunications, industrial, scientific and other compute intensive embedded applications.
Compliant with the PICMG 2.0 CompactPCI core specification and the 2.1 Hot Swap standards the PP SC2/P3x provides a 32/64-bit CompactPCI interface using the Intel 21154 transparent bridge.
For applications requiring more than 8 CompactPCI slots an optional expansion bus companion board is available enabling support for up to 14 CompactPCI peripheral slots.
A variety of floppy and EIDE mass storage drive options are also supported.
The Pentium III features its own integrated 32 Kbyte internal Level 1 and 256 Kbytes Level 2 cache that operates at full CPU speed.
In addition, the Level 2 cache has been improved due to Intel's implementation of its Advanced Transfer Cache, which provides a 256-bit data path, 8-way associativity and a reduced latency.
The board utilizes the 82440BX chipset capable of supporting 100MHz front side bus and 576 Mbytes of S-DRAM.
Additional features of the PP SC2/P3 include dual Intel 82559 Ethernet controllers, high performance Wide Ultra-2 SCSI and EIDE interfaces, VGA using Asiliant Technologies' 69030, 8 Mbytes of application Flash EPROM, keyboard, mouse, two serial ports, parallel port, Real-time Clock and watchdog timers.
For additional I/O expansion capability the PP SC2/P3x has a single PMC site.
All I/O is available via the front panel or can be routed to the back of the system via a transition module that also includes support for bootable EIDE Flash disks.
"The Pentium III Flip-Chip PGA packaging uses Intel's 0.18 micron Coppermine technology which makes it an ideal processor to use for thermally sensitive, space constrained, embedded applications," commented Roger Wilson, Technical Product Manager at Concurrent Technologies.
" The low power requirements of this processor together with careful consideration to board layout and heat sink design were major factors in being able to restrict the thermal envelope to a single slot." To simplify integration and application migration, the board supports industry standard operating systems including Windows NT, VxWorks, Solaris(tm), Linux and QNX.
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