Product category:
Adhesives, threadlockers and other consumables
News Release from: Chomerics Europe | Subject: Thermattach T411 silicone adhesive tape
Edited by the Engineeringtalk Editorial
Team on 23 March 2001
Double-sided tape simplifies PCB
assembly
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners when bonding heat sinks to microprocessors
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners when bonding heat sinks to microprocessors and other heat-generating semiconductors Suitable for bonding heat sinks to any plastic component package including those with non-flat surfaces, combines a high bond strength, pressure-sensitive adhesive (PSA) with an expanded aluminium mesh carrier layer
This article was originally published on Engineeringtalk on 9 Apr 2001 at 8.00am (UK)
Related stories
Effective semiconductor cooling in tight spaces
Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors in restricted space
Its high bond strength allows the tape to be used to attach components to vertical heat sinks or metal chassis walls, while the mesh carrier allows the tape to conform to the curved surfaces of moulded plastic IC packages.
Chomerics Thermattach T411 tape has a thickness of 0.28mm and a thermal impedance rated at 6.5øC-cm2/W.
The high-performance silicone PSA ensures adhesion to silicone-contaminated plastics and other low-energy surfaces.
Thermattach T411 has a rated operating temperature range of -50 to 150øC.
• Chomerics Europe: contact details and other news
• Email this article to a colleague
• Register for the free Engineeringtalk email newsletter
• Engineeringtalk Home Page
Search the Pro-Talk network of sites
