Effective semiconductor cooling in tight spaces
A
Chomerics Europe product story
Edited by the Engineeringtalk editorial team
Apr 9, 2001
Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors in restricted space
Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors in designs where restricted space prevents the use of conventional heat sinks or heat sink/fan combinations.
Ideal for cooling microprocessors and other devices in high-component density applications, the new C-Wing heat spreaders are ceramic, electrically non-conductive devices that feature a strong, pressure-sensitive adhesive for simple attachment to component packages.
C-Wing ceramic heat spreaders are available in a variety of standard sizes that can be quickly and easily added to existing designs to lower component temperatures and improve reliability.
Standard C-Wing parts are made from aluminium oxide and offer a thermal conductivity rating of 26W/m-K.
Chomerics can also supply aluminium nitride versions for use in applications where higher levels of cooling performance are required.
Utilising the Chomerics Thermattach pressure-sensitive adhesive, C-Wing heat spreaders have a profile of just 1.53mm and are flammability rated in accordance with UL 94V-0.
In addition to the standard parts, Chomerics can use advanced thermal measurement and modelling techniques to develop application-specific heat spreader designs.
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