Spindle improves accuracy and throughput
Greater accuracy and higher throughput in automatic wafer testing systems can be achieved using a high-speed aerostatic (air bearing) Colibri spindle.
Greater accuracy and higher throughput in automatic wafer testing systems can be achieved using a high-speed aerostatic (air bearing) Colibri spindle.
The BER Series of "motorised bearing technology" (MBT) spindles though designed for automatic scanning of semiconductor wafers is ideal for a broad range of operations requiring a high performance spindle.
In the wafer inspection process a rotating wafer is scanned with a laser for flaws, contamination, and/or imperfections.
In this and other scanning operations the performance of the spindle is critical.
Features of the Colibri's BER series spindles include high acceleration/deceleration, high speed (up to 10,000rev/min), very low runout (0.2 to 0.5um), high stiffness, clean room compatibility, integral encoder, through-the-shaft vacuum and self-cooling.
Incorporating Colibri's "motorised bearing technology" (MBT), BER series spindles are available with any spindle nose required.
Balanced to G 0.4 standards and with the low friction, high stiffness (7N/um axial and 10N/um radial), and the precise axis definition typical of aerostatic bearings, these smooth running spindles are ideal for semiconductor wafer inspection and other laser positioning systems.
With a power output of up to 550W, these compact, motorised spindles feature up to 0.6Nm of torque and yet are just 120mm in diameter and 190mm long.
The use of the electrical motor as a radial bearing contributes to the high load capacities of 75N radial and 100N axial.
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