Product category:
Vision and Colour Sensors
News Release from: Cognex UK | Subject: Patmax
Edited by the Engineeringtalk Editorial
Team on 22 November 2004
Chip bonders need high resolution vision
F and K Delvotec Bondtechnik in Munich uses integrated machine vision from Cognex.
In bonding technology, many image processing problems are intensified and multiplied To ensure precise bonding, the minute dimensions of the chips require strong magnification in image capturing and high-quality imaging systems must fulfil specific requirements
This article was originally published on Engineeringtalk on 29 May 2001 at 8.00am (UK)
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In comparison with normal image processing, the problems of illumination, contrast and distortion or depth of focus are intensified.
The contrast qualities of the chips, of their coated surfaces, patterns and textures, may exhibit great dissimilarities due to material related properties.
With these small-sized chips, minute tilting can for example have a considerable effect on the quality of the image with regard to contrast.
The highest demands are imposed upon the image processing systems used in this critical production technology and Dr Ing Farhad Farassat, Managing Director of F and K Delvotec Bondtechnik in Munich explains: "We have to work with a 50-fold magnification and the precision and process safety of the image processing system are extremely important to us?.
?The decision to use integrated machine vision from Cognex was primarily based on the reliable vision tools and the high-precision results of the vision algorithms down to the sub-pixel region".
Further reading
Matching software solves inspection problems
Cognex has extended the capabilities of its industry-leading PatMax geometric pattern matching technology with new enhancements for pattern location and alignment.
Vision sensors gain pattern matching software
PatMax geometric pattern matching software is now available on Cognex In-Sight vision sensors.
PC based vision system passes the benchmark
Mikron chose Cognex's PC based PatMax technology for part recognition in the Polyfeed application after speed, robustness and precision benchmarking was done with several vision algorithms.
"It was also necessary to be able to handle the very short cycle times safely".
The main task of image processing in machines for die-bonders and wire-bonders is the exact determination of the position of the chips together with their patterns, edges, circles and drill holes.
The frame grabbers from the MVS-family from Cognex could be embedded in the Unix real time processing of the machines.
Using the Patmax vision software package, this geometry-oriented vision software is clearly different from that of the other competitors said Cognex.
With these patented methods, characteristics such as contours with low contrast can be identified a great deal faster, far more accurately and with greater reliability.
On the basis of a partial contour, Patmax will for example, immediately recognise where to find further features despite distortion, displacement or covering.
It is no longer necessary to conduct a linear analysis of the complete plotted image.
That simplifies the identification of features and it makes the vision system very fast, flexible and reliable.
Delvotec is achieving a measuring accuracy of 1/50th of a pixel by using Patmax and cycle times of 30 to 50ms for the complete process from searching to result are mastered.
Regarding exact positioning, pattern quality and the reference pattern, the value of 1um is attained, which is an important contribution to process quality.
Different illuminations are necessary in the machines, corresponding with the parts to be manufactured and all the lighting systems, such as red, blue or white light, lateral light and incident light have to be guided directly with the image processing system.
This is also accomplished using Patmax.
Corresponding with the results, the latest fifth generation F and K Delvotec machines are being equipped with Patmax and the high-performance hardware from the MVS 8000 family.
The new bonder-series 64/66000 G5 can process thin wires of 17um, as well as thick wires of up to 600um diameter on one single machine.
The speedy replacement of the bonding head allows maximum flexibility and cost-savings in a very broad field of applications.
Furthermore, the bonding quality is also increased.
In the processing of 17um thin wire, this means for example, that only minimal gaps of 2-3um can be achieved between the bonded wires.
The PC-based vision systems from Cognex have been integrated at Delvotec since 1996.
During that time, around 2000 machines have been equipped with both Cognex hardware and software and more than two thirds of those machines went to non-European markets.
All new machines are being fitted with the efficient vision-package Patmax, which not only allows very convenient programming of complex requirements thanks to the graphically supported user-interface, but it also allows access to the precise localisation of objects, even under very difficult conditions, added Cognex.
Dr Farassat commented: "With respect to the new challenges regarding speed, precision and contrast behaviour, there isn't any better system available for our machines than Patmax?.
Cognex said that the potential capabilities of Patmax are fundamentally greater than those that are used presently.
But that already opens up additional ranges of application and safety for the future.
The fact that Delvotec also intends to take the issue of high-grade quality inspection into consideration for its machines in an even greater extent in the future, is a compliment to the technology from Cognex, believes the company.
Dr Farassat concluded: "In selecting the image processing system, we have conducted detailed tests internally and at the customers' facilities over a period of three years".
"The clear decision made in 1996 in favour of Cognex hasn't changed since then?. Request a free brochure from Cognex UK ...
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