Product category:
Materials testing equipment
News Release from: DatapointLabs
Edited by the Engineeringtalk Editorial
Team on 06 December 2005
Datapoint Labs and UGS enter data
agreement
Datapoint Labs to provide material property data for UGS NX Nastran users using its Testpaks technology.
Datapoint Labs is to provide material property data for UGS NX Nastran users using its Testpaks technology As part of the agreement, Datapoint has become a member of the UGS global partner programme
This article was originally published on Engineeringtalk on 19 Feb 2001 at 8.00am (UK)
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With the increasing use of modern non-linear materials such as composites, metals, rubber, elastomers, plastics and foams, CAE users are increasingly faced with the dilemma of where to get material data inputs for their simulation programs.
Testpaks technology streamlines the process of material model calibration by providing somewhere for CAE users to get their materials tested, analysed and reduced into model parameters.
Testpaks provide a complete picture of material behaviour, as dictated by the design of their CAE program.
This quantitative definition of their materials behaviour is translated into NX Nastran as digital CAE-ready input decks.
"With Testpaks, NX Nastran users will be able to have their materials tested to generate load-and-go material models for their analyses by simply ordering a line-item from our online catalogue," said Hubert Lobo, Datapoint Labs President.
Over the coming months, Datapoint will introduce Testpaks for linear and non-linear NX Nastran applications.
The goal is to enable UGS clients to be able to implement a wide range of FEA on various materials.
With the help of Testpaks, they can simulate a host of material behaviours including stiffness, failure, creep, stress relaxation, fatigue and impact over a different temperatures and conditions.
Datapoint will also offer technical support to NX Nastran users in material modelling strategies, model selection and implementation, over the phone and via its web site.
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