Product category:
Materials and components
News Release from: DSM Engineering Plastics | Subject: PA4T polymer
Edited by the Engineeringtalk Editorial
Team on 15 January 2008
Polymer keeps it strength at high
temperatures
DSM Engineering Plastics' PA4T polymer is designed to assist automakers in continued weight reduction efforts for better fuel efficiency and lower costs.
DSM Engineering Plastics has released the PA4T polymer, offering excellent dimensional stability, compatibility with lead-free soldering, high stiffness and mechanical strength at elevated temperatures, a high melting point and excellent processability in terms of flow and processing window The new polymer will suit to market trends for miniaturisation and convergence of electronic devices like mobile phones and computers
This article was originally published on Engineeringtalk on 4 Jan 2006 at 8.00am (UK)
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Fibre-reinforced polyamide aids connector design
DSM Engineering Plastics has introduced a new grade to the Stanyl Polyamide 46 global portfolio.
It will assist automakers in continued weight reduction efforts for better fuel efficiency and lower costs.
According to Roelof Westerbeek, Global Business Director, Stanyl: "PA4T materials are highly suitable for electronics applications such as memory card connectors, CPU sockets, high-temperature bobbins and notebook computer memory module connectors, based on its excellent compatibility in lead-free surface mount technology and dimensional stability".
"In automotive markets, we expect the material to support new developments in under the hood applications relating to automotive electrical systems, air/fuel and powertrain components".
"This development will support green initiatives such as lead free soldering and improved fuel economy".
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