Compact cooling for power modules and lasers
An
Elite Thermal Engineering product story
Edited by the Engineeringtalk editorial team
Aug 11, 2008
Novel design combines state-of-the-art forging and heatpipe technology to deliver 0.08C/W in a compact 160 x 160mm footprint.
New from Elite Thermal Engineering, the model HS-008 is a compact high-performance fan/heatsink assembly with three embedded heatpipes.
The heatsinks in the same class on the market are much larger and less effective.
Elite's HS-008 combines state-of-the-art forging technology and heatpipe technology to deliver 0.08C/W in a compact 160 x 160mm footprint.
Forged fins have the lowest thermal resistance between the fins and the base, and provide higher fin density than conventional process; the three embedded heatpipes are the most effective heat spreader for high power high heatflux heat sources.
Low spreading resistance and compact size make HS-008 an ideal choice for high power IGBTs, power convertor modules and high power laser sources.
HS-008 also has segmented high density fins that break down laminar flow layers periodically along the flow path to increase turbulence.
Higher turbulence improves fin efficiency.
The HS-008 comes with two high power 60mm fans, a fan duct and a terminal block for easy connection to power supplies.
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