12M1B integrates with hybrid or SMT packages
An
Endevco product story
Edited by the Engineeringtalk editorial team
Sep 28, 2009
Endevco has announced the model 12M1B, a high-impedance piezoelectric accelerometer, packaged as a surface-mount chip component.
The sensor is designed for integration into standard hybrid or SMT electronics packages, along with custom-designed signal conditioning units, allowing the engineer to create miniaturised shock and vibration measurement systems in one package.
Weighing 120mg and operating in temperatures up to 150C, model 12M1B features Endevco's Piezite-type P-8 bimorph sensing element, operating in bender mode.
This material offers low base-strain sensitivity, low pyroelectric output, and high-charge output versus size.
Contact with the P-8 sensing element is made via two thick-film gold metallic mounting pads, located on the bottom surface of the aluminum case.
Model 12M1B is suitable for use in low-cost, high-volume and OEM applications, as well as the manufacturing and testing of electronic devices, security systems, medical devices (such as pacemakers and cardiac defibrillators), wireless smart structures, smart motor tools and accelerometer loggers within the oil, gas and petrochemical industry.
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