SEM picture wins first prize
An
ERA Technology product story
Edited by the Engineeringtalk editorial team
Nov 15, 2002
ERA Technology has been awarded first prize for a "false colour" scanning electron microscope (SEM) picture of degradation occurring in a solder interface on a chip.
ERA Technology has been awarded first prize for a "false colour" scanning electron microscope (SEM) picture of degradation occurring in a solder interface on a chip.
This has just been awarded at the 28th International Symposium for Testing and Failure Analysis, which took place in Phoenix, Arizona, USA during November 2002.
The prize is a wall plaque, and a year's free subscription to the Electronic Devices Failure Analysis Society.
The Reliability and Failure Analysis (RFA) business unit of ERA specialises in providing rapid, independent technical analysis and consultancy in: diagnosing engineering reliability problems, the technology of electronic manufacturing materials and devices, and implementing upcoming recycling (WEEE) and hazardous substance ban (RoHS) legislation.
Whilst the RFA group concentrates on electronic technologies it also draws on complementary skills in ERA on electrical and mechanical systems, providing an analytical service in all areas of engineering, quality control, reliability and failure.
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