EMC simulation extends to larger models
PAM-CEM Solutions offers industrial coupling capabilities that allow users to handle realistic models and access real electromagnetic multiscale phenomena.
ESI Group has released a new version of its PAM-CEM Solutions package, providing realistic and predictive electromagnetic compatibility (EMC) simulations for the transport, aerospace, defence, telecommunications and electronics industries.
"With the aim of offering more predictive tools for electromagnetic simulations, PAM-CEM Solutions combines all of the enhancements that were identified by our industrial partners as key features required for realistic simulation", says Dr Jean-Claude Kedzia, PAM-CEM Solutions Product Manager.
PAM-CEM Solutions offers industrial coupling capabilities that allow users to handle realistic models and access real electromagnetic multiscale phenomena.
When dealing with industrial models, conventional strategies usually rely on either global (using stand-alone full-wave Maxwell modelling) or local approaches (using specialised tools focusing on induced effects on wiring).
PAM-CEM Solutions is unusual in being able to mix both: it includes both 3D time domain simulations for reflected or diffracted phenomena, and Cripte, a dedicated transmission-line tool for cable networks.
The developers of this latest version have also paid special attention to the management of large-scale models that include several dozen million elements (STL or Nastran files) and hundreds of wires (close to the real model), for 3D computations featuring billions of unknowns.
The key enhancements to the new version of PAM-CEM Solutions include improved management of large-size STL models and Nastran files featuring several dozen million elements, with a faster importing stage and easier management.
There is also now full interactive addressing of cable networks, including dynamic allocation, management of different loads on terminal connectors, full specification of voltage and current generators (location and cable selection), and generation of all data files with the display of cross sections and tubes content.
In order to allow the efficient management of large-scale fully equipped models, the 3D computational stage has also been upgraded and CPU-optimised.
Other additions include increased postprocessing capabilities, such as surface currents display, extended multiple-frequency output of all relevant results starting from one single 3D run, and modelling of lossy dielectric grounds through dedicated PML (perfectly matched layers) boundary conditions.
PAM-CEM Solutions is available on Windows XP or Unix platforms (HP, Sun and IBM), and for Linux kernels (32 and 64bit versions).
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