Product category:
Fluid, thermal, noise and vibration analysis software
News Release from: Flomerics | Subject: Flo/Stress
Edited by the Engineeringtalk Editorial
Team on 03 May 2001
Thermomechanical stress module for
thermal program
Flomerics has launched Flo/Stress, a thermomechanical stress module for its Flotherm V3.1 thermal management package giving accurate thermomechanical calculations at the product design stage
Flomerics has launched Flo/Stress, a thermomechanical stress module designed to provide users of its Flotherm V3.1 thermal management package with the facility to make fast, first-order accurate thermomechanical calculations at the product design stage, so reducing significantly the problem of electronic failure and minimizing 'time-to-market' The new module is ideally suited for predicting the linear elastic behaviour of layered cuboid structures such as Printed Circuit Boards (PCBs), Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs) and Flip-Chips
This article was originally published on Engineeringtalk on 9 Sep 2008 at 8.00am (UK)
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Commenting on the launch, John Parry, Research Manager, Flomerics, said, "Combating electronic failure at the pre-prototyping stage is a crucial design issue for electronic engineers and manufacturers keen to ensure that their end products are manufactured to the highest quality and within the shortest possible time frame.
Through its tight integration with Flotherm, Flo/Stress is one of the first products aimed at predicting thermomechanical stress at such an early stage of the physical design process and is set to reduce significantly manufacturers' time to market." Flo/Stress accepts orthotropic and temperature dependent material property data for all 3-D cuboidal objects.
Stress-free temperatures can be applied on an object-by-object basis.
Flo/Stress can be used immediately after a Flotherm calculation has been made, with minimal model setup time as it shares the existing Flotherm model geometry.
The results of the stress calculation can then be readily displayed in Flomotion, Flomerics' post-processing visualization tool.
Flo/Stress has been developed during a TCS programme with the University of Greenwich, with funding until June 2002 being provided by the UK's DTI.
Flomerics will also be undertaking further research into stress prediction within the EC-funded PROFIT* project (Prediction of Temperature Gradients Influencing the Quality of Electronic Products), which commenced in January 2000.
Here, Flomerics will develop compact models of layered structures by determining how to calculate thermomechanically-equivalent material properties for composites. Request a free brochure from Flomerics ...
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