Speciality compound removes secondary processes

ID Systems was looking for ways to further strengthen its market position by streamlining its VAC manufacturing process.

Based in Hackensack, New Jersey, ID Systems provides wireless solutions for corporate asset management.

These systems enable managers to remotely control and track the location and status of their assets - from forklifts and cranes to automobiles and trucks - in real time.

One of ID Systems' products is the Vehicle Asset Communicator (VAC), a wireless computer installed in vehicles to restrict access, manage safety and security issues, track location, and monitor a wide range of vehicle utilisation data.

As a fast-growing company - named to the 2005 Deloitte Technology Fast 500 list - ID Systems was looking for ways to further strengthen its market position by streamlining its VAC manufacturing process.

The existing process for manufacturing the VAC housing called for injection-moulding the two halves of the 6 x 8 x 3in enclosure from flame-retardant polycarbonate (PC) resin and then electroplating the part with a copper substrate and nickel top coat to provide shielding against electromagnetic interference (EMI).

Electromagnetic compatibility (EMC) is essential for the VAC's wireless communications, and using the enclosure to deliver electromagnetic shielding has proven itself to be an effective means for meeting the functional and regulatory requirements.

However, the secondary electroplating operation was a drawback for several reasons.

First, it added cost and time to the manufacturing process.

Secondly, the bosses and standoffs incorporated into the housing design made it difficult to ensure even coverage of the metallised coating, resulting in part rejects.

And, the coating operation raised concerns about worker exposure to emissions and recycling difficulties.

According to Greg Smith, Vice President of Marketing and Corporate Communications for ID Systems: "Our VACs must have EMI shielding and comply with UL requirements for flammability resistance, but we wanted a better way to provide these properties - a new approach that would help us save money and time while reducing environmental and health risks".

"On the other hand, we didn't want to go through the expense and delay of retooling for a new material".

"Thankfully, our moulder put us in touch with GE Plastics, who provided an excellent solution for us".

To meet all of ID Systems' requirements, the company selected GE's LNP Faradex DS-1003 FR HI speciality compound, which offers intrinsic EMI shielding through the incorporation of fine, stainless steel fibres into PC resin.

GE's LNP Faradex specialty compound provides approximately 40 to 70dB of EMI attenuation, depending on frequency and part geometry.

It is formulated to achieve balanced dispersion of the steel fibres to optimise shielding effectiveness.

In addition, the GE material provides other important performance properties, including enhanced low-temperature impact to help prevent damage to VACs during exterior use, and low surface resistivity that can make it easier to ground the electronic device.

It can also be custom coloured to meet specific aesthetic requirements.

Another benefit of the GE's LNP Faradex specialty compound is that it processes very similar to unfilled PC with nearly similar shrinkage, enabling ID Systems to use its existing tooling.

Finally, GE's LNP Faradex specialty compound addressed the need for the use of halogen free flame retardants, while still meeting the need to use a material with a UL94V0 flammability rating.

"GE's technical resources were used by ID Systems and their moulder during material selection discussions and moulding trials", said Jim Fagan, Product Manager for GE Plastics.

"We were engauged on tooling and processing details to help our customer ensure that gating configuration and moulding procedures were optimised for the best shielding performance".

"GE expertise helped ensure the housing not only looks great, but also delivers superior performance across the board".

Replacing electroplated PC with GE's LNP Faradex DS-1003 FR HI specialty compound allowed ID Systems to eliminate a costly and time-consuming secondary operation while continuing to fulfil the requirement for EMI shielding of its VAC devices.

Thanks to the inherent shielding of the GE material, the company has been able to reduce production time and costs.

Further, eliminating electroplating has addressed health concerns from toxic emissions during the metallisation process and the need to remove the metallised layer prior to recycling the part.

As an added benefit, GE's LNP Faradex specialty compound solved the issue of part rejects due to inconsistent or incomplete application of the electroplating.

Equally important, the company was able to swap materials without retooling, achieving additional time and cost benefits.

Back to top