Conference paper explains reverse engineering

An ICEM product story
Edited by the Engineeringtalk editorial team May 6, 2005

ICEM is to present a paper on the use of reverse engineering technology in the product development process at Rapid.Tech 2005.

ICEM is to present a paper on the use of reverse engineering technology in the product development process at Rapid.Tech 2005.

The conference takes place at the Exhibition Centre, Erfurt, Thuringia, Germany on 31st May and 1st June.

Organised by Messe Erfurt and supported by Verein Deutscher Ingenieure, Rapid.Tech 2005 will examine the technologies supporting and the issues surrounding the uptake of today's rapid prototyping, rapid tooling and rapid manufacturing techniques and processes.

Conference sessions will cover process chains and concepts, direct metal processes, direct and indirect processes for metals and plastics and quality assurance.

These will be supported by a number of product development and manufacturing case studies.

ICEM's paper, presented by Alexander Back, one of ICEM's technical experts from the company's offices near Frankfurt, is entitled "Reverse engineering bridges the virtual and physical product development processes".

It examines the way in which reverse engineering and surface modelling software can be used together to speed the iterative process of product development by creating and then modifying both a virtual and a physical model of a new or revised product.

In addition to presenting the paper in the conference sessions, ICEM, together with laser scanning equipment manufacturer Konica Minolta, will also demonstrate a complete reverse engineering and surface modelling workflow environment in the accompanying technical exhibition.

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