Inseto secures wire bonding equipment order
An
Inseto (UK) product story
Edited by the Engineeringtalk editorial team
May 13, 2009
UK-based power semiconductor manufacturer Dynex has placed an order with Inseto for an Orthodyne 3600Plus aluminium wire bonder.
The 3600Plus is Orthodyne's latest high-speed, high-accuracy wedge bonder designed for power modules, automotive packages and other large wire MCM applications.
It is claimed to deliver exceptional productivity, low cost of ownership and the flexibility to grow with market demands, including conversion to the latest Power-Ribbon technology.
'The 3600Plus was the first choice when we decided to invest in additional wire bonding equipment for our high-power insulated gate bipolar transistor power modules,' said Peter Waind, engineering manager of Dynex.
'This new platform is over 30 per cent quicker than the older equipment, delivers enhanced process capability and also has an off-line programming module, enabling us to fully utilise the system for our production requirements,' he added.
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