Potting compounds cure at room temperature to 25mm
An
Intertronics product story
Edited by the Engineeringtalk editorial team
Jan 28, 2002
Two new UV curing potting compounds are designed to reach areas under components where the light does not reach, making them ideal for applications including potting sensors and LEDs
Two new Dymax UV curing potting compounds from Intertronics combine instant UV curing with the ability to cure at room temperature to depths 25mm or more.
They are also designed to reach areas under components where the light does not reach, making them ideal for a variety of electrical and electronic applications including potting sensors and LEDs.
960A/B and 961A/B are designed for ease of application through disposable tip, static mix dispensers.
Following dispensing, exposure to long wave UV light cures the products to a depth of 6.5mm in 20 seconds or less.
The remaining liquid resin gels in 7 to 20 minutes, with full cure achieved in 24 hours at room temperature.
These 2-part plus UV curing potting materials provide the fast cure benefits of light curing products with the chemical cure properties of traditional potting compounds.
Light is used to cure the top layer of the system, up to 12.5mm deep, while the 2-part chemical cure continues in shadow and deeper areas in the potting cavity.
This eliminates drying racks and off-line heat curing processes.
960A/B and 961A/B are rated for UL 94V-0 applications.
Besides their good environmental resistance, adhesion to substrates, and hard outer surface, they form a resilient, low stress protective encapsulant around delicate parts found below the UV-cured surface.
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