Super-soft gaskets seal without silicone
An
Intertronics product story
Edited by the Engineeringtalk editorial team
Apr 5, 2004
Dymax GA-108 is a highly compressible (00-30) FIP gasket that solves a number of quality and processing issues confronting gasket users.
Dymax GA-108 is a highly compressible (00-30) FIP gasket that solves a number of quality and processing issues confronting gasket users.
Major benefits include superior seals (often with less material), complete cure in seconds and the elimination of silicone contamination.
Curing completely in seconds on exposure to UV light, GA-108 allows instant part assembly.
It cures to a black appearance on black parts and hides the gasket seam.
It has good adhesion to Nylon and many metals, making it ideal for many appliance and automotive assemblies.
GA-108 is so soft that it does not register on the A-shore durometer scale.
Its compressibility allows the use of less resin without sacrificing part fit, a feature not inherent in more rigid gaskets.
This softness also reduces the force or pressure needed to close the assembly and to maintain the seal.
Excellent seals are provided for fragile as well as robust housings.
It is designed for use from -60 to +150C.
GA-108 cures completely on exposure to UV light, with no other curing mechanisms involved.
This instant cure eliminates the space, labour, material, and storage costs associated with racking and stacking large numbers of in-process parts.
The gasket is simply exposed to UV light and allowed to cool prior to the part being packaged or assembled.
GA-108 is well suited to high-speed automated assembly.
The gasket can be UV cured with high intensity lamps on conveyorised assembly lines at 30-60cm per minute.
As GA-108 contains no silicone, it eliminates worries about silicone contamination and is ideally suited for inline use in facilities that paint or electroplate parts.
It can also be used to seal electronic assemblies without concerns about the corrosive byproducts generated from some silicones.
As GA-108 does not moisture cure, humidity control is unnecessary for cure, and humidity induced clogging of dispensing lines is eliminated.
Intertronics supplies a complete line of complementary curing and dispensing systems as part of its adhere solutions range.
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