Product category:
Gauges, Indicators and Instruments
News Release from: Kaisertech | Subject: MicroJoin Model 5200 PDI Bonder
Edited by the Engineeringtalk Editorial
Team on 18 October 2000
Flux, bond and test small LCDs with one
unit
MicroJoin's new Model 5200 PDI Bonder efficiently integrates the fluxing, bonding and testing processes for small LCD displays within a single, cost-effective assembly system
Available from Kaisertech, MicroJoin's new Model 5200 PDI Bonder efficiently integrates the fluxing, bonding and testing processes for small LCD displays within a single, cost-effective assembly system This achieves average cycle times of 12-15 seconds per completed and tested display, all within a compact 40in
This article was originally published on Engineeringtalk on 13 Jun 2001 at 8.00am (UK)
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wide x 45in.
deep x 55in.
high unit.
Further reading
Rework system handles large size PCBs
The Sniper-WB, available from Kaisertech, has been developed to rework PCBs as small as 51mm x 51mm right up to 508mm x 610mm, although even larger boards can be accommodated by special request.
Integrating soldering, heat seal and ACF bonding
Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF bonding
Ideal for efficiently automating the attachment of LCD displays to cell phones, cordless telephones, pagers, or GPS systems, the 5200 is designed for operation in either production lines or standalone production cell environments and can be loaded/unloaded by an operator or optionally interfaced to robotic handling systems.
The unit's three-position rotary table optimises throughput by enabling loading/unloading, bonding and testing processes to run simultaneously.
In addition, two work pieces are bonded within a single cycle to further boost overall output.
Its vision system has pattern recognition and closed-loop process control software with data logging to provide precision automated testing of the completed displays, thereby producing consistent results with minimal operator intervention.
The bonding sub-system can use either precision metal hot bars or MicroJoin's patented Ceramic Hot Bar Technology (CHBT) to flexibly handle either solder or ACF (anisotropic conductive film) processes for flex-to-LCD, flex-to-PCB, flex-to-glass or TAB-to-PCB applications.
For solder applications, the system includes an optional auto-flux process during the loading process.
When the work pieces have been precisely positioned for bonding, the bond head extends and automatically executes the pre-programmed time/temperature/pressure profile with real-time process control of all parameters.
Cooling gases, such as air or nitrogen, can be injected to speed process time, while the hot bar remains in contact with the work pieces until the head has cooled to a pre-programmed temperature.
After bonding, the completed displays are rotated to the test position where test pins automatically extend to the PCB contact points to power and test the display.
High-resolution cameras capture the display images and compare them to test programs using sophisticated pattern-recognition techniques.
The 5200 is capable of automatically identifying pixel level defects, icon presence/quality, and backlight brightness levels/consistency.
All process parameters, test results and failed images are automatically captured and recorded to disc or uploaded directly into manufacturing SPC programs. Request a free brochure from Kaisertech ...
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