Kontron welcomes publication of COM Express guide
A
Kontron UK product story
Edited by the Engineeringtalk editorial team
Jun 4, 2009
Kontron has welcomed the publication of the COM Express Carrier Board Design Guide 1.0 by the PCI Industrial Computer Manufacturers Group (PICMG).
As a next step, according to Kontron, a PICMG specification for smaller computer-on-modules is essential, as demands in the market for these are increasing.
Norbert Hauser, vice-president of marketing at Kontron, said: 'For COM Express, it's an important milestone that the COM Express Carrier Design Guide has been published by PICMG.
'It guarantees that modules from different manufacturers that conform with the COM Express specification are interchangeable on the carrier boards based on the design guide 1.0,' he added.
The introduction by Kontron the compact MicroETXexpress (measuring 95mm x 95mm) and ultra-small NanoETXexpress (55mm x 84mm) modules - following pin-outs Type 2 and 1 respectively - offers up two COM Express-compatible footprints that represent a logical advancement of the existing COM Express specification to basic and extended footprints already noted under the standard.
An official PICMG specification for these smaller computer-on-modules would make COM Express a universal specification for all module sizes and guaranteed compatibility of carrier boards, according to Kontron.
Consequently, the company claims, this will lead to an even faster and more widespread usage of COM Express modules in a range of applications, in addition to the ousting of other alternatives that are less vendor independent.
The 160-page publication provides complete vendor-independent standardisation, which is required for scalable computer-on-module designs.
The PICMG Carrier Design Guide 1.0 offers information for developers of custom-designed carrier boards for COM Express modules.
In combination with the latest COM Express specification and the module vendors' product manuals, the design guide simplifies design efforts and guarantees the optimal interchangability of computer-on-modules from different manufacturers.
For reference, it includes connection diagrams and external switching circuits, as well as descriptions of suitable implementation solutions for all COM Express interfaces.
The guide was produced in cooperation with 14 different manufacturers to ensure that carrier boards are developed according to best-practice principles.
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