Product category:
Electrical and Electronic Components
News Release from: Molex UK | Subject: Copper core Radial Fin heat sinks
Edited by the Engineeringtalk Editorial
Team on 22 May 2001
Radial Fin heat sinks cool
microprocessors
Molex is helping to offer maximum thermal performance and quieter PC's with its latest product - copper core Radial Fin heat sinks - for applications with SECC2 and PGA microprocessors found in person
Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper core Radial Fin heat sinks - for applications with SECC2 and PGA microprocessors found in personal computers, workstations and servers Using Molex's patent pending radial folded fin design, these heat sinks generate a 360-degree airflow that results in higher volumetric efficiency and lower fan noise than traditional extruded heat sinks
This article was originally published on Engineeringtalk on 8 Mar 2001 at 8.00am (UK)
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All models feature a high fin count and hollow copper core that minimises weight without decreasing performance.
A spring clip helps to ensure easy mounting to standard microprocessor sockets, including Socket 462 and Socket 370.
To help meet challenging shock and vibration requirements, a dual tab clip is also available.
During full-system thermal testing, these heat sinks achieved as low as 0.5C per Watt, measuring case to ambient (includes thermal interface material).
Molex offers a variety of interface materials and fan choices.
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