Molex has routing configuration for interconnects
A
Molex UK product story
Edited by the Engineeringtalk editorial team
Oct 1, 2008
Molex has introduced new routing configurations to the FlexPlane optical flex circuitry for high fibre-count interconnects in backplanes and cross-connect systems.
One of the most dense and versatile interconnect systems on the market today, Molex's FlexPlane provides a completely customisable means of routing fibre from card-to-card or shelf-to-shelf.
FlexPlane is available in multiple design options, the standard FlexPlane (Series 106401) provides high-density routing on a flexible, flame-resistant substrate.
The flame-retardant FlexPlane assembly (Series 106404) meets the UL Optical Branching Device Flammability requirements.
Providing almost a 50 per cent substrate size reduction compared to the standard FlexPlane, where the flex circuits are routed on a single substrate, the 3D FlexPlane (Series 106406) routes the fibre on multiple stacked substrates.
This is critical, as board space and air flow continue to become a stringent part of OEM design requirements.
A variety of interconnects, including Blind Mate MTP (BMTP), High Density Blind Mate MT (HBMT), Blind Mate LC (BLC) and Blind Mate SC (BSC) can be used to connect the optical flex circuits to individual cards in a shelf.
Available in any routing scheme, fibre can be routed point-to-point, in a shuffle, or in a logical pattern to meet specific requirements.
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