Versatile epoxy has high thermal conductivity
A
Master Bond product story
Edited by the Engineeringtalk editorial team
Oct 31, 2006
EP21AOHT is a high-temperature-resistant two-component thermally conductive epoxy adhesive, sealant and coating.
EP21AOHT is a high-temperature-resistant two-component thermally conductive epoxy adhesive, sealant and coating developed by Master Bond.
This versatile system has a good thermal conductivity of over 1.44W/m-K and adheres unusually well to a wide variety of substrates including metals, glass, ceramics and many plastics.
As an adhesive, it forms high strength bonds of 34MPa in tensile strength, 14MPa in shear and over 140MPa in compression.
As a matter of fact its compressive modulus is 4275MPa.
EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the wide temperature range of -50 to +205C.
The EP21AOHT paste features easy application with a convenient, noncritical, one to one mixing ratio and a convenient self levelling feature so it goes on evenly and smoothly.
Versatile cure schedules are available ranging from room temperature cures or fast elevated temperature cures in a short 40 minutes or starting as low as 65C.
EP21AOHT has excellent electrical insulation properties with a dielectric strength greater than 1V/um.
It also possesses a low coefficient of thermal expansion (COE/CTE) of only 20um/m/C, low shrinkage and excellent dimensional stability.
It is available in pint, quart, gallon and 5 gallon container kits.
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Contact Master Bond
Tel () +44 207 100 7251
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