Adhesive handles high temperatures

Master Bond EP33 maintains its bonding strength even when exposed to 205-235C temperatures.

Master Bond EP33 is a room temperature curing epoxy adhesive for high-temperature bonding applications developed by Master Bond , Hackensack, New Jersey, USA.

This two-component epoxy offers the convenience of a room temperature cure with high-temperature performance combined with good physical strength and di-electric properties.

It produces high strength bonds exceeding 220kg/cm in shear and maintains this strength even after exposure to temperatures in the 205-235C range.

Curing can be accomplished at room temperature or in as little as one hour at 95C.

Master Bond Polymer Adhesive EP33 bonds well to similar and dissimilar substrates both at room and at elevated temperatures.

It produces durable, high-strength, tough bonds which are remarkably resistant to thermal cycling, high radiation levels and chemicals, including water, oil, and most organic solvents.

Adhesion to metal, glass, ceramics, wood, vulcanised rubbers and many plastics is excellent.

The hardened adhesive is an excellent electrical insulator with superb di-electric performance.

This combination of properties allows EP33 to be used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

EP33 is available in premixed bi-packs and cartridge/gun packaging for convenient dispensing as well as in standard pint, quart, gallon and five gallon containers.

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