Single-component epoxy is easy to handle
Master Bond EP11HT is a heat-curing, structural epoxy adhesive featuring high shear strength and easy handling.
Polymer System EP11HT is a single-component epoxy resin system from Master Bond for high-temperature bonding applications up to 205C.
Master Bond EP11HT is a heat-curing, structural epoxy adhesive featuring high shear strength and easy handling.
It is formulated to cure at elevated temperatures, for example 110min at 120C or 75min at 150C.
EP11HT attains tensile shear strengths in excess of 22.75MPa and forms rigid and dimensionally stable bonds.
The service temperature range is -50 to +205C.
As a one-part system, it does not require mixing prior to use and has an "unlimited" working life at room temperature.
EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics.
It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents.
A nondrip version called EP11HTND-2 is also available.
The cured adhesive fully meets the requirements of MIL-MMM-A-132.
It is available in pint, quart, gallon and 5 gallon containers.
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Tel () +44 207 100 7251
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Cure adhesive has high bond strength
Master Bond has released a UV adhesive compound that combines high-strength bonds with the benefits of UV cure, namely high productivity, improved performance and environmental compliance. -
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Master Bond's EP30BN is a two-part boron nitride epoxy adhesive offering improved thermal management of heat-generating components. -
Easily mixed polymer cures at room temperature
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Epoxy-resin system resists high temperatures
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Adhesive offers rapid curing
When the Master Bond EP30-4 adhesive is spread in films thin as 0.635mm, it will become tack free in as little as 30 minutes.
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