Thermal epoxy adhesive optimises heat transfer
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Master Bond product story
Edited by the Engineeringtalk editorial team
Sep 25, 2009
Master Bond's EP30BN is a two-part boron nitride epoxy adhesive offering improved thermal management of heat-generating components.
EP30BN is a medium-viscosity epoxy system with good flow characteristics, making it a suitable thermally conductive adhesive for bonding, sealing and potting applications.
Featuring high thermal conductivity and good electrical insulation properties, the thermal epoxy is designed to optimise heat dissipation of aerospace, defence and micro-electronic assemblies with minimal weight penalty.
It is formulated to cure at room temperature, or more rapidly at elevated temperatures, to a tough, thermoset, dimensionally stable plastic.
Mechanical strength properties and chemical resistance are maintained over the temperature range -60F to 300F (-50C to 150C).
Master Bond said that EP30BN has excellent electrical insulation properties with a volume resistivity in excess of 1,014 ohm cm, a thermal conductivity of 24 BTU/hr/ft2/F/in and a specific gravity of only 1.1.
EP30BN two-part thermally conductive epoxy is for applications requiring effective heat management for high-tech devices with weight-sensitive components together with electrical insulation and environmental protection properties.
Master Bond's two-part epoxy system offers high bond strength to a wide variety of different substrates, gap-filling capabilities, electrical insulation, high chemical inertness and resistance to shock and vibration.
Special formulations include thermally conductive and electrically conductive adhesive systems, adhesives serviceable in cryogenic applications, as well as adhesive compounds that withstand the most hostile environmental conditions.
Viscosities and cure times can be tailored to meet specific application requirements.
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Tel () +44 207 100 7251
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