Diamond spreads the heat
A
Morgan Advanced Ceramics product story
Edited by the Engineeringtalk editorial team
Jul 26, 2002
Diamonex CVD diamond heat spreaders are ideal for high power device applications, such as laser diodes, microwave FETs and MMICs, and advanced multichip modules (MCMs).
Diamonex CVD diamond heat spreaders are ideal for high power device applications, such as laser diodes, microwave FETs and MMICs, and advanced multichip modules (MCMs).
Due to diamond's extremely high thermal conductivity, Diamonex CVD diamond heat spreaders improve performance by reducing junction temperatures, allowing for increased power output, speed, and reliability.
Recent studies show a 50% reduction in thermal resistance compared with CuW and 25-40C drop in junction temperatures compared to copper heat spreaders.
In addition, Diamonex CVD diamond material has a high electrical resistivity, which allows top-to-bottom isolation in the package design.
Typical diamond submounts for laser diodes, MMIC/FETs and MCMs range from 0.020 x 0.020 to 1.0 x 1.0in or larger, with thickness from about 200um to 1mm.
Thicker submounts can be accommodated via a composite heat spreader comprised of CVD diamond and a high thermal conductivity ceramic.
The heat spreaders are equipped with a variety of full-area (six-sided or two-sided insulated) and patterned metalizations that are solderable (eg Ti/Pt/Au or Au-Sn) for die attach, or brazeable.
Prices start at less than $1 per submount in high volumes.
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