Epoxy solves demands for high peel strength
A
Bondmaster product story
Edited by the Engineeringtalk editorial team
Feb 13, 2003
A new epoxy adhesive achieves peel strengths on composite and aluminium substrates superior to any other formulation in its class.
Adhesive bonds have traditionally been strong in shear but weak in peel strength; many designers and engineers have found this feature limits their use when joining composite or aluminium structures.
Bondmaster has patented an epoxy adhesive E3334 which achieves peel strengths on composite and aluminium substrates superior to any other adhesive in its class.
Bondmaster E3334 has excellent flow characteristics, which make it ideal for bonding sheets of dissimilar materials to form composite laminates.
E3334's high peel strength allows the laminates to be pressed and formed after bonding without degradation of the bond.
E3334 is a two-component adhesive which cures at room temperature enabling large structures to be bonded.
External heating may be used to accelerate cure time for faster production of smaller items.
Typical applications include the manufacture of composites for truck, bus, marine and commercial airline interiors as well as numerous specialist construction and assembly applications where high peel strength is critical.
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