Novel way of bonding low-surface-energy substrates
A
Bondmaster product story
Edited by the Engineeringtalk editorial team
May 20, 2003
A recently published paper outlines a novel technique for bonding low-surface-energy substrates such as polypropylene using a combination of air-plasma surface treatment and a flexible epoxy adhesive.
A recently published paper outlines a novel technique for bonding low-surface-energy substrates such as polypropylene using a combination of air-plasma surface treatment and a flexible epoxy adhesive.
The research work was presented to the ASC (Adhesive and Sealants Council) in St Louis, USA by Bondmaster's Research Technologist, Terry Gordon.
The paper was well received by conference delegates as the challenge of bonding polypropylene surfaces has long confounded designers and adhesives researchers alike.
The work described in the paper typifies the research underway at Bondmaster where a holistic view of the bonding process is taken in order to provide product designers with practical solutions to the demands they make on adhesives, substrates and production processes.
The content of the paper widens the choice of materials available for product designers and makes the way clear for improved product performance and increased process efficiency.
A copy of the paper can be obtained by contacting Bondmaster.
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