Process routes create precise micro components
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Precision Micro product story
Edited by the Engineeringtalk editorial team
Oct 19, 2009
Precision Micro has developed two process routes capable of creating precise micro components in prototype to high-volume quantities where increased complexity does not incur a cost penalty.
The first process route, the laser-evolved etching process (LEEP), incorporates laser technology in the precision etching process.
LEEF micro perforated slot mesh with 20 micron wire equivalent and 90 per cent open area
Laser direct imaging (LDI) gives the process the capability to create accurate micro components, with both fine features and high complexity, to tight tolerances measured in microns.
The technology removes the need for traditional photo tools.
Feature alignment is precise and the higher-resolution exposure ensures that edges are sharper and more precisely defined, according to the company.
It is now possible to create micro channels in the 25-micron range, with a four-fold improvement in pitch accuracy across an 800 x 600mm sheet.
The second process route, laser-evolved electroforming (LEEF), is very effective when requirements call for extreme tolerances, complexity or a light weight.
Parts created in this way are claimed to have superior edge definition and a near optical finish with fine feature limits being defined by the photographically produced pattern on the substrate.
By direct imaging the pattern onto the substrate using advanced LDI, far tighter tolerances can be maintained and features of less than 15 microns can be achieved with high repeatability and process control.
LEEF facilitates higher levels of complexity at tighter tolerances, achieving fine features without the use of prohibitively expensive glass master tooling, according to the company.
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