Power modules provide redundancy
A
Pepperl+Fuchs GB product story
Edited by the Engineeringtalk editorial team
Oct 4, 2007
The compact HiD power modules provides very low heat dissipation of less than 2W and can be mounted in any direction.
Pepperl+Fuchs has released the FieldConnex High Density (HiD) Power Hub, a compact 360mA complement to the existing 500mA FieldConnex Power Hub.
The HiD Power Hub is a high-performance platform of motherboards and power supplies that uses 25V to supply up to a 360mA load output.
The system is suited to large fieldbus applications requiring redundancy.
The compact HiD power modules provides very low heat dissipation of less than 2W and can be mounted in any direction.
As a result, HiD users will benefit from maximum mounting flexibility and high packing density High packing density leads to fewer required cabinets and reduced space requirements in the plant.
Standardising on this new modular solution eliminates additional planning, installation and commissioning effort.
Passive impedance generation and well-balanced electric circuit design contributes to strong signal quality, smooth and reliable operation and a long service life.
A choice of motherboards exists to fit any control system, and can be pre-installed using connectors with retaining screws, or tailor-made versions with system plugs of the DCS.
Two power supply modules are load sharing, and can be plug into the motherboard's sockets while the system is energised.
The HiD Power Hub is fully compatible with Pepperl+Fuchs' Advanced Diagnostic Module.
The ADM makes commissioning easy and bridges the gap between manual troubleshooting and automatic diagnosis easy evaluation of Foundation Fieldbus and Profibus installations.
Engineering contractors, commissioning experts, plant operators and maintenance specialists gain visibility into the fieldbus physical layer for faster commissioning work, easy troubleshooting, providing the information needed to shift to condition based maintenance strategies.
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