Product category:
Electronics Manufacturing, Tools and Instruments
News Release from: Palomar Technologies | Subject: Model 3500-III
Edited by the Engineeringtalk Editorial
Team on 01 August 2006
Automatic die bonder offers increased
precision
Palomar Technologies presents the latest version of its award-winning automatic die bonder, the Model 3500-III.
Palomar Technologies' Latest Automatic Die Bonder Offers Increased Precision and Accuracy Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, presents the latest version of its award-winning automatic die bonder, the Model 3500-III Designed for fully automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area
This article was originally published on Engineeringtalk on 22 May 2001 at 8.00am (UK)
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Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules, and hybrid microcircuits.
The 3500-III is capable of performing automated eutectic die attach utilising backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets.
Palomar's patented eutectic process is key for high yield and reliability because eutectic die attach is one of the most difficult processes to control.
Palomar's pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the 3500-III's sub-micron axis resolution yields typical placement repeatability of better than +/-12 micron (0.5 mil), 3 sigma with fluids, +/-5 micron (0.2 mm), 3 sigma with pulse heat eutectic applications.
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With the 3500-III, placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms.
Relative-to-die placement algorithms place the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package.
This provides greater accuracy from component to component.
It also controls the subsequent wire length and position, ensuring that the wires are parallel and the lengths are the same, factors important for high frequency electrical performance.
The machine base is a honeycomb core optical table that provides vibration damping and thermal settling response superior to granite.
Its work area is the largest available.
The cantilever design permits unobstructed, open access on three sides for set-up.
Soft touchdown or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as gallium arsenide.
An 8-position turret head can rapidly change tools on the fly without a space and time-consuming tool dock assembly.
Because it is constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.
The 3500-III employs an infrared light curtain around the entire open perimeter of the assembly cell.
This safety curtain sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation.
When the system is in operation and the safety curtain is violated, the system immediately (within 3 milliseconds) shorts the inputs to the digital servo driven motors, bringing all motion to a near instant stop.
The system uses a Windows XP operating system, employing Cognex Corporation's latest Series 8000 gray-scale pattern recognition systems.
The graphical, user-friendly interface assists in bonding set-up, operation, diagnostics, and calibration.
The new, high-visibility, flat screen displays on the 3500-III greatly improve the unit's ergonomics.
It is SMEMA compatible and can be configured with loaders to provide small island operations or complete in-line system solutions.
From wafer to eutectic die attach, handling options are fully programmable.
"The Model 3500-III is a workhorse machine, yet it is the most flexible, precise, accurate die bonder available," said Palomar Technologies president, Bruce Hueners.
"It has been referred to as the 'Swiss Army Knife of bonders'".
Customers seeking to extend the service life and increase productivity of their Model 3500-II Automatic Component Placement Systems can now order a 3500-III upgrade directly from Palomar and achieve the same high level of reliability and productivity as a new Model 3500-III.
The 3500-III upgrade includes a faster 32-bit computing system, Windows XP operating system, faster and more versatile Cognex 8000 Pattern Recognition system, energy-efficient space-saving flat panel displays, and a suite of powerful software tools featuring Bond Data Miner (BDM) which includes improved process development tools, automated SPC data documentation and component traceability.
Customer trials indicate an increase in productivity measured in raw throughput of up to 18%, depending on materials and application.
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