Product category:
Cabling, Conduit, Accessories and Signal Conditioning
News Release from: Red Lion Controls | Subject: ITMS4037 Temperature to Modbus Conditioner
Edited by the Engineeringtalk Editorial
Team on 19 June 2000
Convert temperature signals to Modbus
format
Red Lion has introduced the new ITMS4037 Intelligent Temperature to Modbus Conditioner, with alarms, for many process applications.
Red Lion has introduced the new ITMS4037 Intelligent Temperature to Modbus Conditioner, with alarms, for many process applications The ITMS accepts a wide range of temperature sensors and will handle thermocouple, RTD, mV or resistance signals and convert them into a resister format that can be read using either ASCII or RTU Modbus protocol
This article was originally published on Engineeringtalk on 21 Feb 2001 at 8.00am (UK)
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A choice of either a Fahrenheit or Celsius readout is offered, with 0.1 or 1 degree of resolution.
An offset value can be programmed to scale the input signal to meet most process requirements.
Additionally, two setpoint values can be entered for dual relay process monitoring alarms.
The two relay alarms can be configured independently for absolute high or low acting with balanced or unbalanced hysteresis.
Alarm 2 can also be configured for deviation and band alarms.
In these modes, Setpoint 2 tracks Setpoint 1.
Adjustable alarm trip delays can be used for delaying output response and the alarms can be programmed to be automatic or latching.
For ease of configuration, calibration, and storage of program files, the ITMS is programmed with Windows* based SFIMS software.
Additionally, all setup parameters can be interrogated and modified through Modbus register and coil commands.
The RS485 port allows the ITMS to be multidropped, with Baud rates up to 38400, and the CBPROO07 programming cable converts the RS232 port of a PC to RS485.
The bi-directional capability of the CBPROO07 allows it to be used as a permanent interface cable as well as a programming cable.
Installation time and panel space are also reduced through the module's high-density packaging and DIN rail mounting with a universal mounting foot.
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