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Product category: Materials and components
News Release from: RTP Company | Subject: Plastic materials for the electronics industry
Edited by the Engineeringtalk Editorial Team on 29 July 2003

Platable compounds form electronic
circuits

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Cybershield uses a variety of platable systems from RTP Company to provide custom engineered solutions for the electronics industry.

Cybershield developed its Exact technology to allow precise, selective, plating of plastic materials for the electronics industry Originally performed for decorative purposes, the metallisation of plastics is now seen as the key to providing the effective shielding and conductivity required in modern electronic devices

Cybershield uses a variety of platable systems from RTP Company to provide custom engineered solutions for the electronics industry.

Cybershield's technology enables antenna, circuitry, interconnection, shielding and thermal management solutions to be integrated into thermoplastic housings and substrates.

For example, circuit patterns can be applied directly onto plastic housings and components in two and three dimensions.

3D patterns can be applied with lines and spaces down to 0.127mm with a resolution of 0.025mm.

Kenwood Martin, Vice President for Business Development at Cybershield, said: "The Exact process enables designers to integrate electrical and mechanical functionality into a single plastic part.

The net result is reduced lines in the build of materials (BOM), increased reliability and enhanced function and performance of electronic devices".

Martin continued: "We saw in RTP Company the potential for a union that is unique in its ability to provide specifically engineered electronics solutions.

RTP Company has real expertise in providing exact performance in plastics.

There is a genuine synergy with our abilities to identify and meet the plating needs of electronics manufacturers".

Martin also cites RTP Company's expertise with a wide range of materials and its experience in customising those materials as key to the arrangement.

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