Elastomer compounds bond to multiple substrates
A
RTP Company product story
Edited by the Engineeringtalk editorial team
May 2, 2008
RTP 6042 elastomer compounds offer a wide processing window to moulders using either multishot or insert moulding techniques.
The TPE Division of RTP has released the RTP 6042 series of bondable thermoplastic elastomer compounds.
Standard grades have been formulated to bond to a variety of rigid substrates including PC, ABS, PC/ABS, PC/PBT, PC/PMMA and RTPU resins.
The new RTP 6042 products offer a wider processing window than the RTP 6002 series.
Additional benefits include superior bonding performance and more consistent mechanical properties across a hardness spectrum from 50 to 75 Shore A.
According to Paul Killian, Technical Marketing Manager - TPE Division, "The critical element in any over-moulding process is the chemical bond between the soft elastomeric material and the rigid substrate".
"Our new RTP 6042 series TPEs offer excellent bonding performance, which is essential for long application life cycles in the field".
"RTP company sees an immediate fit with consumer applications due to the products' easy colouring and a great cost to performance ratio", Killian said.
"The materials are also particularly well suited for rugged electronic devices with over-moulded designs where excellent tensile and tear strength as well as abrasion resistance is required".
RTP 6042 products offer a wide processing window to moulders using either multishot or insert moulding techniques.
"New designs and advanced processing technology continue to push the over-moulding envelope" Killian said.
"It is critical to provide moulders with as much process latitude as possible".
"One of our goals with this new series was to offer products that have the widest possible processing window for the injection moulders".
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