High-efficiency cooling for CPCI systems
A
Schroff UK product story
Edited by the Engineeringtalk editorial team
Feb 11, 2000
Schroff develops new high-efficiency cooling solutions for CPCI systems For systems used in industrial or computing environments where high ambient temperatures are present, Schroff, Europe's leading
For systems used in industrial or computing environments where high ambient temperatures are present, Schroff, Europe's leading manufacturer of electronic enclosures, has developed a new range of air-cooling solutions for use in CPCI subrack systems.
Both forced air and convection cooling options are available to suit most thermal management requirements.
For natural air convection, all Schroff CPCI packaging systems feature perforated top and bottom covers with a perforation percentage of 58%; this provides more than adequate air flow for the majority of lower power dissipation systems.
In higher power systems or more demanding environments, a forced air cooling solution is recommended.
Schroff offers two modular air cooled options that can be placed on either the bottom or top of a subrack.
For bottom frame mounting, a low-noise, high-reliability 1U fan tray has been developed which accommodates up to three axial fans.
A new technique is used for the actual fan attachment, which sees two foamed plastic sections and integral cable ducting replace conventional nuts and bolts.
Axial fans are inserted into the foam sections and secured within the tray.
This new fan attachment technique not only ensures the fans are held securely but also helps reduce noise levels and increase the life of the fans with MTBF increased to 60Khrs; 50% improvement on previous 40Khrs as fans are no longer subjected to shock and vibrations caused from fixing to sheet metal.
Schroff also provides a radial fan solution for applications where it is impractical to use axial fans such as when CPCI systems are stacked on top of each other.
The radial fans are mounted above the subrack with air being pulled from the front and pushed to the rear of a CPCI system.
Using this radial method frees the back of the system for rear I/O boards.
CPCI combines the advantages of proven PC technology with the robustness of 19" systems.
The PCI bus, as used in many offices today, has been coupled with a rugged subrack to produce a low cost, reliable alternative to VME.
Basing CPCI on standard PC technology ensures hardware and software is both well supported competitively priced.
Over the next few years, it is predicted that CPCI will become the de-facto microcomputer packaging systems standard in telecommunications, network and data systems, automation and control, traffic and medical systems around the world.
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