The optimal PC*MIP front-panel solution?
A
Schroff UK product story
Edited by the Engineeringtalk editorial team
Feb 29, 2000
These panels provide engineers with easier assembly, comprehensive EMC shielding and an aesthetically pleasing appearance, all at a competitive price.
Following intensive collaborative work on the new PC*MIP specification, the PCI-based mezzanine standard, Schroff, has developed a new range of PC*MIP-compliant mezzanine front panels.
Fitted onto the front of a mezzanine daughter card, these panels provide engineers with easier assembly, comprehensive EMC shielding and an aesthetically pleasing appearance, all at a competitive price.
Backed by leading industrial systems suppliers, MEN Mikro Elektronik/N�rnberg, Germany, SBS/GreenSpring USA, Motorola and Schroff, PC*MIP modules (PCI and M-modules and industry packs) are designed to supersede M- and IP-modules, and replace the double-sized PMC-boards within many applications.
Unlike conventional backplanes or desktops, the new PC*MIP mezzanine modules mount parallel to the carrier board enabling many more boards to be supported within a given system.
Schroff offers both 3U/4HP front panel with single and double cut-outs for PC*MIP front connectors, and 6U/4HP models with two double cut-outs.
The double holes are suited for one or two single-size type II modules, or one double-size type II board.
The cut-outs are filled by blank aluminium bezels to match the front panels.
6U Eurocards and PCI desktop boards are able to support six PC*MIP modules on a single carrier board - a 50% density improvement on IP modules.
Two special captive screws are used to install and remove the PC*MIP modules from the carrier boards.
These have been designed to disengage the module's electrical connection to a carrier board once the captive screws have been loosened, making installation and removal of a mezzanine card easy.
The carrier board front panel and system rear-panel I/Os are fully supported by PC*MIP form factors.
The I/O connectors are situated near the module's transceiver and system I/O to suppress distortion, cross-talk and interference.
The module's I/O connectors have also been placed at opposite ends to the PCI bus permitting flow-through signal routing - a first for a standard module.
A fully-standard PCI bus provides the host-side electrical interface from the module to the carrier board.
While a PCI bus is also employed on a PMC module, PC*MIP's version is smaller, denser and more versatile.
3.3V PCI signalling is used to reduce power consumption and eliminates any mechanical keying and voltage compatibility problems.
5, 12 and -12V lines can all be tapped from the module.
PC*MIP mezzanine modules will be used in communication, medical, military and avionics, data-acquisition, factory automation and mobile systems.
A diverse range of functions are currently available on PC*MIP mezzanine modules including; LAN/WAN; serial communications; local processing functions such DSP, speech, encryption and error-correction; memory, video and LCD display controllers and peripheral interfaces like SCSI and USB.
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Contact Schroff UK
Tel +44 1442 240471
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