Sensor produces real-time pressure maps
Tactilus is a novel electronic tactile force and pressure indicating sensor that allows an engineer to monitor precisely how force is disbursed between any two contacting surfaces in real time.
Tactilus is a novel electronic tactile force and pressure indicating sensor that allows an engineer to monitor precisely how force is disbursed between any two contacting surfaces in real time.
Tactilus is a valuable aid in R and D and QC/QA in determining proper pressures in wafer polishing as well as in wafer bonding pressure distribution.
"The system will aid in determining precise pressure distribution for not only the actual wafer bonding process", says Senior Technical Manager Jeffrey Stark, "but also for proper polishing head contact pressures.
Balancing contact pressures between the bonding head/wafer interface or polishing head/wafer interface during machine set-up can help maximise yields and machine utilisation".
Stark noted the system could be used for either single-spindle or multispindle heads.
Custom sensor designs are possible and can be designed to measure the entire area under a multispindle head.
Tactilus is "a Windows-based system that consists of an electronic sensor element 'skin'", continued Stark, "an interface controller, and software.
The sensor skin is essentially a thin flexible sheet that is densely packed with sensing points or pixels.
These sensing points can be spaced as close as 1mm apart and can collect data as rapidly as 60,000 times per second".
The Tactilus sensing element is only 10 mils, allowing adaptation over curved surfaces or invasive intolerant environments.
"The Tactilus element's internal structure is very durable and can be utilised for thousands of tests before replacement is necessary", Stark concluded.
The sensor system is precalibrated and requires minimal user training prior to operation.
System requirements are Windows 95 (and higher) OS, 16Mbyte free disk space and 64Mbyte RAM.
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