Sercos interoperability demonstrated in Chicago
A
Sercos North America product story
Edited by the Engineeringtalk editorial team
Sep 19, 2006
The Sercos interface trade associations will exhibit a Sercos interoperability demo at Pack Expo 2006, from 29th October to 2nd November, at McCormick Place, Chicago, Illinois.
The Sercos interface trade associations will exhibit a Sercos interoperability demo at Pack Expo 2006, from 29th October to 2nd November, at McCormick Place, Chicago, Illinois.
The exhibit, demonstrating interoperability of Sercos II and Sercos III motion controllers and servodrive products from multiple vendors, will be in the OMAC Packaging Workgroup booth, number C-64, strategically located in the concourse entrance to upper level McCormick Place North.
The demo features a new Sercos III controller from AMK and another new Sercos III controller and servo drives from Bosch Rexroth.
This portion of the demo showcases new Sercos III products that utilise Industrial Ethernet as their hardware platform.
It highlights the new Sercos Controller-to-Controller (C2C) profile, which interconnects and synchronises three controllers in the demo.
The C2C profile allows cross communication and synchronisation of controls and even individual servodrives in different parts of a machine or packaging line, and meets the cell bus requirements of the OMAC Packaging Workgroup.
The controller-to-controller profile takes into consideration innovative Sercos III features, such as hardware redundancy, hot-plugging and cross communication.
In addition, a third Sercos controller from Bosch Rexroth runs Sercos II drives (using fibre optics) from AMK, Lust DriveTronics, Baumueller, Bosch Rexroth, and Yaskawa.
The controllers and drives all conform to the SERCOS interface Pack Profile, a subset of the Sercos interface functions defined specifically for multivendor interoperability of servo controls and drives for packaging machinery.
This controller also incorporates the C2C profile to communicate with the other two controllers in the system.
The demo illustrates the benefits to the packaging machine builder and end user of utilising the Sercos interface international standards, plus OMAC guidelines for interoperability such as controller-to-controller communication and the Sercos Pack Profile.
The demo also illustrates a migration concept for Sercos II devices and Pack Profile to the new Sercos III, based on Industrial Ethernet.
After Pack Expo, the demo will be exhibited in the Sercos booth at the SPS/IPC/Drives show from 28th to 30th November 2006 in Nuremberg, Germany.
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