Introduction to MEMS and MOEMS
A
Sira product story
Edited by the Engineeringtalk editorial team
Jul 25, 2002
Organised jointly by Sira and SPIE, a new short course covers microfabrication and packaging of micromechanical electronic components.
Organised jointly by Sira and SPIE (the International Society for Optical Engineering) a new short course covers microfabrication and packaging of micromechanical electronic components.
"MEMS and MOEMS: related microsystems and applications" is aimed at engineers, scientists and managers wishing to receive an introduction to microelectromechanical systems and micro-optoelectromechanical systems.
By combining microelectronics and micromechanical components, these devices promise to have a major impact on future sensors and actuators.
The two-day non-residential course takes place on 30th September and 1st October 2002 in Bromley, Kent.
It is presented by Dr Ajay P Malshe of the University of Arkansas, an associate professor whose specialist fields include integration and advanced packaging of microsystems.
The course covers the new advanced micro and meso scale manufacturing technologies, which will result in high performance devices and products that are lighter, easier to produce, more efficient and less expensive than conventionally produced components.
Topics covered include scaling in a microscopic world, surface and bulk micromachining, nontraditional fabrication processes such as femtosecond laser and micro EDM processing, packaging and assembly of micro devices and future directions.
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