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News Release from: System Devices | Subject: Snap-AITM-8
Edited by the Engineeringtalk Editorial
Team on 08 September 2006
Modules increase I/O density
The Snap-AITM-8 is first of many new high-density versions of Snap I/O coming out over the next few months.
The Snap-AITM-8 is first of many new high-density versions of Snap I/O coming out over the next few months It is a thermocouple and millivolt input module that quadruples the I/O density of standard Snap thermocouple modules and lowers the list cost per point by approximately 33%
The Snap-AITM-8 accepts up to eight channels of temperature or millivolt input from a variety of standard thermocouples (B, C, D, E, G, J, K, N, R, S, or T) or +/-75, +/-50 or +/-25mV millivolt devices.
The Snap-AITM-8 thermocouple/millivolt module is available immediately, with ioProject software and firmware support expected in the fourth quarter.
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