Product category:
Electronics Manufacturing, Tools and Instruments
News Release from: Tecan | Subject: Mini re-work stencils
Edited by the Engineeringtalk Editorial
Team on 22 November 2000
Mini re-work stencils save time and
money
Mini stencils from Tecan Stencils Limited (TSL) ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB re-work operations.
Mini stencils from Tecan Stencils Limited (TSL) ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB re-work operations Individual component footprints are faithfully replicated by the mini stencils, with apertures which precisely correspond to the pads on the PCB from where the original component was removed
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
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New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
Rework is completed in a cost effective and controlled manner with far more consistent results than traditional hit and miss'methods.
In combination with a rework station, the stencils ensure human error and alignment problems are significantly reduced resulting in a controlled 'right first time' solution.
In operation, the stencil is simply placed in position on the 'cleaned' pads and paste is deposited by hand using a mini squeegee blade.
The accurate apertures ensure exactly the right amount of paste is deposited, folded edges provide protection from any overspill, localised re-flow follows.
The stencils are supplied as assemblies complete with all necessary interfaces, such as articulated stalks or vacuum attachments, for the rework station or placement system adopted.
Accurately folded edges and run-on/run-off areas ensure that the compact stencil does not interfere with other components on the populated PCB.
Mini stencils are also available for re-balling and fluxing BGA's and for SM connectors and similar components.
Mechanical and thermal stresses are kept to a minimum using the technique allowing devices to be re-flowed without exceeding manufacturers' recommended stress limits.
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