Product category:
Electrical and Electronic Components
News Release from: Tecan
Edited by the Engineeringtalk Editorial
Team on 26 July 2001
Separate RFI arm for RFI screening can
specialist
Tecan Components has divisionalised its successful RFI arm - creating what it calls "a dedicated fast-response design to delivery facility for cost-effective bespoke screening solutions"
Tecan Components has divisionalised its increasingly successful RFI arm - creating a dedicated fast-response 'design to delivery' facility for cost-effective bespoke screening solutions Free consultation followed by ongoing advice and support are available from a dedicated design team offering savings in time and costs from the outset
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
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Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
The company welcomes entry into the system at any level, offering value-engineered solutions whatever the individual case and ensuring 'defined costs for defined goals'.
Exploiting its detailed knowledge of RFI solutions, the company offers structured levels of service, catering for those who know they need screening but don't know where to go next, to those with fully dimensioned drawings needing professional enhancements to incorporate special manufacturing techniques, for example.
Other everyday considerations include maintenance access, PCB real estate, crosstalk and EMC needs.
Also on offer are design guidance, site visits, prototyping, sample production, finish and thickness options, forming, assembly and re-evaluation of established designs for productivity enhancements and cost reduction.
The company uses a range of well-established and proven manufacturing systems, such as photo-chemical machining (PCM) and punch/press progression tooling, to provide cans for the most demanding low, medium or high-volume production needs.
Cost-effective bespoke product production is the norm, says Tecan.
Typical cans may include an open-ended selection of options such as fences, dividing walls, multi-sided enclosures, labyrinths, full enclosures, spring-finger lids, simple fold lids, dimple-lock lids and screening meshes.
Resultant fabrications are designed to meet end-user's specific assembly, production and life-long requirements, such as hand or surface-mount, re-flow soldering, pick and place assembly, service and maintenance.
The division initiative has pooled all RFI disciplines at Tecan, from estimating and quotation, to enquiry and order administration, production planning and CAD functions.
New dedicated telephone numbers have also been introduced to ensure speedy first-contact responses by directly experienced engineers.
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